MPG3xxxAH-E
DISK DRIVES
PRODUCT MANUAL
C141-E116-01EN
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MANUAL ORGANIZATION
MPG3xxxAH-E
DISK DRIVES
PRODUCT
MANUAL
(C141-E116)
<This manual>
• DEVICE OVERVIEW
• DEVICE CONFIGURATION
• INSTALLATION CONDITIONS
• THEORY OF DEVICE OPERATION
• INTERFACE
• OPERATIONS
MPG3xxxAH-E
DISK DRIVES
MAINTENANCE
MANUAL
• MAINTENANCE AND DIAGNOSIS
• REMOVAL AND REPLACEMENT PROCEDURE
(C141-F050)
C141-E116-01EN
iii
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PREFACE
This manual describes the MPG3xxxAH-E series, a 3.5-inch hard disk drive with a BUILT-IN controller
that is compatible with the ATA interface.
This manual explains, in detail, how to incorporate the hard disk drives into user systems.
This manual assumes that users have a basic knowledge of hard disk drives and their application in
computer systems.
This manual consists of the following six chapters:
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Chapter 5
Chapter 6
DEVICE OVERVIEW
DEVICE CONFIGURATION
INSTALLATION CONDITIONS
THEORY OF DEVICE OPERATION
INTERFACE
OPERATIONS
In this manual, disk drives may be referred to as drives or devices.
C141-E116-01EN
v
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert message consists of an
alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a
signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation likely to result in serious personal
injury if the user does not perform the procedure correctly.
This indicates a hazardous situation could result in personal injury if the
user does not perform the procedure correctly.
This indicates a hazardous situation could result in minor or moderate
personal injury if the user does not perform the procedure correctly. This
alert signal also indicates that damages to the product or other property,
may occur if the user does not perform the procedure correctly.
This indicates information that could help the user use the product more
efficiently.
In the text, the alert signal is centered, followed below by the indented message. A wider line space
precedes and follows the alert message to show where the alert message begins and ends. The following is
an example:
(Example)
IMPORTANT
HA (host adapter) consists of address decoder, driver, and receiver.
ATA is an abbreviation of "AT attachment". The disk drive is
conformed to the ATA-4 interface
The main alert messages in the text are also listed in the “Important Alert Items.”
vi
C141-E116-01EN
LIABILITY EXCEPTION
"Disk drive defects" refers to defects that involve adjustment, repair, or replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user misoperation or
mishandling, inappropriate operating environments, defects in the power supply or cable, problems of the
host system, or other causes outside the disk drive.
C141-E116-01EN
vii
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CONTENTS
page
DEVICE OVERVIEW..........................................................................................1 - 1
CHAPTER 1
1.1
Features .................................................................................................................................1 - 1
Functions and performance ...................................................................................................1 - 1
Adaptability...........................................................................................................................1 - 2
Interface.................................................................................................................................1 - 2
Device Specifications............................................................................................................1 - 4
Specifications summary.........................................................................................................1 - 4
Model and product number ...................................................................................................1 - 5
Power Requirements..............................................................................................................1 - 5
Environmental Specifications................................................................................................1 - 8
Acoustic Noise ......................................................................................................................1 - 8
Shock and Vibration..............................................................................................................1 - 9
Reliability..............................................................................................................................1 - 9
Error Rate..............................................................................................................................1 - 10
Media Defects .......................................................................................................................1 - 10
1.1.1
1.1.2
1.1.3
1.2
1.2.1
1.2.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
CHAPTER 2
DEVICE CONFIGURATION .............................................................................2 - 1
2.1
Device Configuration ............................................................................................................2 - 1
System Configuration............................................................................................................2 - 3
ATA interface........................................................................................................................2 - 3
1 drive connection.................................................................................................................2 - 3
2 drives connection................................................................................................................2 - 3
2.2
2.2.1
2.2.2
2.2.3
CHAPTER 3
INSTALLATION CONDITIONS........................................................................3 - 1
3.1
Dimensions............................................................................................................................3 - 1
Handling Cautions.................................................................................................................3 - 3
General notes.........................................................................................................................3 - 3
Installation.............................................................................................................................3 - 3
Recommended equipments....................................................................................................3 - 3
Mounting...............................................................................................................................3 - 4
Cable Connections.................................................................................................................3 - 8
Device connector...................................................................................................................3 - 8
3.2
3.2.1
3.2.2
3.2.3
3.3
3.4
3.4.1
C141-E116-01EN
ix
3.4.2
3.4.3
3.4.4
3.4.5
3.5
Cable connector specifications..............................................................................................3 - 9
Device connection.................................................................................................................3 - 9
Power supply connector (CN1) .............................................................................................3 - 10
System configuration for Ultra DMA....................................................................................3 - 10
Jumper Settings .....................................................................................................................3 - 13
Location of setting jumpers...................................................................................................3 - 13
Factory default setting...........................................................................................................3 - 14
Jumper configuration.............................................................................................................3 - 14
3.5.1
3.5.2
3.5.3
CHAPTER 4
THEORY OF DEVICE OPERATION ...............................................................4 - 1
4.1
Outline...................................................................................................................................4 - 1
Subassemblies .......................................................................................................................4 - 1
Disk .......................................................................................................................................4 - 1
Head ......................................................................................................................................4 - 2
Spindle ..................................................................................................................................4 - 2
Actuator.................................................................................................................................4 - 3
Air filter.................................................................................................................................4 - 3
Circuit Configuration.............................................................................................................4 - 4
Power-on Sequence...............................................................................................................4 - 6
Self-calibration......................................................................................................................4 - 8
Self-calibration contents........................................................................................................4 - 8
Execution timing of self-calibration ......................................................................................4 - 9
Command processing during self-calibration ........................................................................4 - 9
Read/write Circuit .................................................................................................................4 - 10
Read/write preamplifier (PreAMP) .......................................................................................4 - 10
Write circuit ..........................................................................................................................4 - 10
Read circuit ...........................................................................................................................4 - 11
Synthesizer circuit .................................................................................................................4 - 12
Servo Control ........................................................................................................................4 - 13
Servo control circuit..............................................................................................................4 - 13
Data-surface servo format .....................................................................................................4 - 16
Servo frame format................................................................................................................4 - 17
Actuator motor control..........................................................................................................4 - 18
Spindle motor control............................................................................................................4 - 19
4.2
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.3
4.4
4.5
4.5.1
4.5.2
4.5.3
4.6
4.6.1
4.6.2
4.6.3
4.6.4
4.7
4.7.1
4.7.2
4.7.3
4.7.4
4.7.5
x
C141-E116-01EN
CHAPTER 5
INTERFACE.........................................................................................................5 - 1
5.1
Physical Interface ..................................................................................................................5 - 2
Interface signals.....................................................................................................................5 - 2
Signal assignment on the connector.......................................................................................5 - 3
Logical Interface ...................................................................................................................5 - 6
I/O registers...........................................................................................................................5 - 6
Command block registers......................................................................................................5 - 8
Control block registers ..........................................................................................................5 - 13
Host Commands ....................................................................................................................5 - 13
Command code and parameters.............................................................................................5 - 14
Command descriptions..........................................................................................................5 - 16
Error posting..........................................................................................................................5 - 76
Command Protocol................................................................................................................5 - 77
Data transferring commands from device to host..................................................................5 - 77
Data transferring commands from host to device..................................................................5 - 79
Commands without data transfer...........................................................................................5 - 81
Other commands....................................................................................................................5 - 82
DMA data transfer commands...............................................................................................5 - 82
Ultra DMA feature set...........................................................................................................5 - 84
Overview...............................................................................................................................5 - 84
Phases of operation................................................................................................................5 - 85
Ultra DMA data in commands...............................................................................................5 - 85
5.1.1
5.1.2
5.2
5.2.1
5.2.2
5.2.3
5.3
5.3.1
5.3.2
5.3.3
5.4
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.5
5.5.1
5.5.2
5.5.3
5.5.3.1 Initiating an Ultra DMA data in burst....................................................................................5 - 85
5.5.3.2 The data in transfer................................................................................................................5 - 86
5.5.3.3 Pausing an Ultra DMA data in burst .....................................................................................5 - 86
5.5.3.4 Terminating an Ultra DMA data in burst ..............................................................................5 - 87
5.5.4
Ultra DMA data out commands.............................................................................................5 - 89
5.5.4.1 Initiating an Ultra DMA data out burst..................................................................................5 - 89
5.5.4.2 The data out transfer..............................................................................................................5 - 90
5.5.4.3 Pausing an Ultra DMA data out burst ...................................................................................5 - 90
5.5.4.4 Terminating an Ultra DMA data out burst ............................................................................5 - 91
5.5.5
5.5.6
5.6
Ultra DMA CRC rules...........................................................................................................5 - 93
Series termination required for Ultra DMA...........................................................................5 - 94
Timing...................................................................................................................................5 - 95
PIO data transfer ...................................................................................................................5 - 95
Multiword data transfer.........................................................................................................5 - 96
5.6.1
5.6.2
C141-E116-01EN
xi
5.6.3
Ultra DMA data transfer........................................................................................................5 - 97
5.6.3.1 Initiating an Ultra DMA data in burst....................................................................................5 - 97
5.6.3.2 Ultra DMA data burst timing requirements...........................................................................5 - 98
5.6.3.3 Sustained Ultra DMA data in burst .......................................................................................5 - 101
5.6.3.4 Host pausing an Ultra DMA data in burst .............................................................................5 - 102
5.6.3.5 Device terminating an Ultra DMA data in burst....................................................................5 - 103
5.6.3.6 Host terminating an Ultra DMA data in burst .......................................................................5 - 104
5.6.3.7 Initiating an Ultra DMA data out burst..................................................................................5 - 105
5.6.3.8 Sustained Ultra DMA data out burst .....................................................................................5 - 106
5.6.3.9 Device pausing an Ultra DMA data out burst........................................................................5 - 107
5.6.3.10 Host terminating an Ultra DMA data out burst .....................................................................5 - 108
5.6.3.11 Device terminating an Ultra DMA data in burst....................................................................5 - 109
5.6.4
Power-on and reset................................................................................................................5 - 110
CHAPTER 6
OPERATIONS ......................................................................................................6 - 1
6.1
Device Response to the Reset................................................................................................6 - 1
Response to power-on ...........................................................................................................6 - 2
Response to hardware reset ...................................................................................................6 - 3
Response to software reset ....................................................................................................6 - 4
Response to diagnostic command..........................................................................................6 - 5
Address Translation...............................................................................................................6 - 6
Default parameters ................................................................................................................6 - 6
Logical address......................................................................................................................6 - 7
Power Save............................................................................................................................6 - 8
Power save mode...................................................................................................................6 - 8
Power commands ..................................................................................................................6 - 10
Defect Management...............................................................................................................6 - 10
Spare area..............................................................................................................................6 - 11
Alternating defective sectors .................................................................................................6 - 11
Read-Ahead Cache................................................................................................................6 - 13
Data buffer configuration ......................................................................................................6 - 13
Caching operation .................................................................................................................6 - 14
Usage of read segment...........................................................................................................6 - 15
Write Cache...........................................................................................................................6 - 20
6.1.1
6.1.2
6.1.3
6.1.4
6.2
6.2.1
6.2.2
6.3
6.3.1
6.3.2
6.4
6.4.1
6.4.2
6.5
6.5.1
6.5.2
6.5.3
6.6
xii
C141-E116-01EN
FIGURES
page
1.1
2.1
2.2
2.3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
Current fluctuation (Typ.) when power is turned on .............................................................1 - 7
Disk drive outerview .............................................................................................................2 - 1
1 drive system configuration .................................................................................................2 - 3
2 drives configuration............................................................................................................2 - 3
Dimensions............................................................................................................................3 - 2
Handling cautions..................................................................................................................3 - 3
Direction................................................................................................................................3 - 4
Limitation of side-mounting..................................................................................................3 - 5
Mounting frame structure......................................................................................................3 - 5
Surface temperature measurement points..............................................................................3 - 6
Service area...........................................................................................................................3 - 7
Connector locations...............................................................................................................3 - 8
Cable connections .................................................................................................................3 - 9
Power supply connector pins (CN1)......................................................................................3 - 10
Cable configuration...............................................................................................................3 - 11
Cable type detection using CBLID- signal
(Host sensing the condition of the CBLID- signal) ...............................................................3 - 12
3.13
Cable type detection using IDENTIFY DEVICE data
(Device sensing the condition of the CBLID- signal)............................................................3 - 12
3.14
3.15
3.16
3.17
3.18
3.19
4.1
Jumper location .....................................................................................................................3 - 13
Factory default setting...........................................................................................................3 - 14
Jumper setting of master or slave device...............................................................................3 - 14
Jumper setting of Cable Select ..............................................................................................3 - 15
Example (1) of Cable Select..................................................................................................3 - 15
Example (2) of Cable Select..................................................................................................3 - 15
Head structure .......................................................................................................................4 - 2
MPG3xxxAH-E Block diagram ............................................................................................4 - 5
Power-on operation sequence................................................................................................4 - 7
Block diagram of servo control circuit..................................................................................4 - 13
Physical sector servo configuration on disk surface..............................................................4 - 15
96 servo frames in each track ................................................................................................4 - 17
Execution example of READ MULTIPLE command ...........................................................5 - 19
Read Sector(s) command protocol ........................................................................................5 - 78
4.2
4.3
4.4
4.5
4.6
5.1
5.2
C141-E116-01EN
xiii
5.3
Protocol for command abort..................................................................................................5 - 79
WRITE SECTOR(S) command protocol ..............................................................................5 - 80
Protocol for the command execution without data transfer ...................................................5 - 81
Normal DMA data transfer....................................................................................................5 - 83
Ultra DMA termination with pull-up or pull-down ...............................................................5 - 94
PIO data transfer timing ........................................................................................................5 - 95
Multiword DMA data transfer timing (mode 2) ....................................................................5 - 96
Initiating an Ultra DMA data in burst....................................................................................5 - 97
Sustained Ultra DMA data in burst .......................................................................................5 - 101
Host pausing an Ultra DMA data in burst .............................................................................5 - 102
Device terminating an Ultra DMA data in burst....................................................................5 - 103
Host terminating an Ultra DMA data in burst .......................................................................5 - 104
Initiating an Ultra DMA data out burst..................................................................................5 - 105
Sustained Ultra DMA data out burst .....................................................................................5 - 106
Device pausing an Ultra DMA data out burst........................................................................5 - 107
Host terminating an Ultra DMA data out burst .....................................................................5 - 108
Device terminating an Ultra DMA data out burst..................................................................5 - 109
Power-on Reset Timing.........................................................................................................5 - 110
Response to power-on ...........................................................................................................6 - 2
Response to hardware reset ...................................................................................................6 - 3
Response to software reset ....................................................................................................6 - 4
Response to diagnostic command..........................................................................................6 - 5
Address translation (example in CHS mode) ........................................................................6 - 7
Address translation (example in LBA mode) ........................................................................6 - 8
Sector slip processing............................................................................................................6 - 11
Alternate cylinder assignment ...............................................................................................6 - 12
Data buffer configuration ......................................................................................................6 - 13
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
5.20
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
xiv
C141-E116-01EN
TABLES
page
1.1
Specifications ........................................................................................................................1 - 4
Model names and product numbers.......................................................................................1 - 5
Current and power dissipation...............................................................................................1 - 6
Environmental specifications ................................................................................................1 - 8
Acoustic noise specification..................................................................................................1 - 8
Shock and vibration specification..........................................................................................1 - 9
Surface temperature measurement points and standard values..............................................3 - 6
Cable connector specifications..............................................................................................3 - 9
Transfer rate of each zone .....................................................................................................4 - 12
Interface signals.....................................................................................................................5 - 2
Signal assignment on the interface connector........................................................................5 - 3
I/O registers...........................................................................................................................5 - 7
Command code and parameters.............................................................................................5 - 14
Information to be read by IDENTIFY DEVICE command...................................................5 - 29
Features register values and settable modes ..........................................................................5 - 36
Diagnostic code.....................................................................................................................5 - 40
Features Register values (subcommands) and functions........................................................5 - 50
Device attribute data structure...............................................................................................5 - 53
Warranty failure threshold data structure ..............................................................................5 - 54
Log directory data structure...................................................................................................5 - 59
Error logging data structure...................................................................................................5 - 60
Self Test log data structure....................................................................................................5 - 61
Contents of security password...............................................................................................5 - 63
Contents of SECURITY SET PASSWORD data..................................................................5 - 68
1.2
1.3
1.4
1.5
1.6
3.1
3.2
4.1
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
Relationship between combination of Identifier and Security level,
and operation of the lock function.........................................................................................5 - 68
5.17
5.18
5.19
5.20
6.1
Command code and parameters.............................................................................................5 - 76
Recommended series termination for Ultra DMA.................................................................5 - 94
Ultra DMA data burst timing requirements...........................................................................5 - 98
Ultra DMA sender and recipient timing requirements...........................................................5 - 100
Default parameters ................................................................................................................6 - 6
C141-E116-01EN
xv
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CHAPTER 1
DEVICE OVERVIEW
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
Features
Device Specifications
Power Requirements
Environmental Specifications
Acoustic Noise
Shock and Vibration
Reliability
Error Rate
Media Defects
Overview and features are described in this chapter, and specifications and power requirement are
described.
The MPG3xxxAH-E series are a 3.5-inch hard disk drive with a built-in ATA controller. The disk drive is
compact and reliable.
1.1
Features
1.1.1
(1)
Functions and performance
Compact
The disk has 1 or 2 disks of 95 mm (3.5 inches) diameter, and its height is 26.1 mm (1 inch).
(2)
(3)
Large capacity
The disk drive can record up to 20.49 GB (formatted) on one disk using the 48/52 EEPR4ML
recording method and 15 recording zone technology. The MPG3xxxAH-E series have a formatted
capacity of 20.49 GB to 40.99 GB respectively.
High-speed Transfer rate
The disk drive has an internal data rate up to 60.7 MB/s. The disk drive supports an external data
rate up to 16.7 MB/s (PIO mode 4, DMA mode 2), 66.6 MB/s (ultra DMA mode 4) or 100MB/s
(ultra DMA mode 5).
C141-E116-01EN
1 - 1
(4)
Average positioning time
Use of a rotary voice coil motor in the head positioning mechanism greatly increases the
positioning speed. The average positioning time is 8.5 ms (at read).
1.1.2
Adaptability
(1)
Power save mode
The power save mode feature for idle operation, stand by and sleep modes makes the disk drive
ideal for applications where power consumption is a factor.
(2)
(3)
Wide temperature range
The disk drive can be used over a wide temperature range (5°C to 55°C).
Low noise and vibration
In Ready status, the noise of the disk drive is only about 3.3 bels (MPG3409AH-E, Typical Sound
Power per ISO7779 and ISO9296).
1.1.3
Interface
(1)
Connection to interface
With the built-in ATA interface controller, the disk drive can be connected to an ATA interface of
a personal computer.
(2)
(3)
2MB data buffer
The disk drive uses a 2MB data buffer to transfer data between the host and the disk media.
In combination with the read-ahead cache system described in item (3) and the write cache
described in item (6), the buffer contributes to efficient I/O processing.
Read-ahead cache system
After the execution of a disk read command, the disk drive automatically reads the subsequent data
block and writes it to the data buffer (read ahead operation). This cache system enables fast data
access. The next disk read command would normally cause another disk access. But, if the read
ahead data corresponds to the data requested by the next read command, the data in the buffer can
be transferred instead.
(4)
Master/slave
The disk drive can be connected to ATA interface as daisy chain configuration. Drive 0 is a
master device, drive 1 is a slave device.
1 - 2
C141-E116-01EN
(5)
(6)
Error correction and retry by ECC
If a recoverable error occurs, the disk drive itself attempts error recovery. The 40 bytes ECC has
improved buffer error correction for correctable data errors.
Write cache
When the disk drive receives a write command, the disk drive posts the command completion at
completion of transferring data to the data buffer completion of writing to the disk media. This
feature reduces the access time at writing.
C141-E116-01EN
1 - 3
1.2
Device Specifications
1.2.1
Specifications summary
Table 1.1 shows the specifications of the disk drive.
Table 1.1 Specifications
MPG3204AH-E
MPG3307AH-E
MPG3409AH-E
Formatted Capacity (*1)
20.49 GB
30.74 GB
40.99 GB
Number of Disks
Number of Heads
1
2
2
4
2
4
Number of Cylinders
(User + Alternate & SA)
30,784 + 735 + 30
Bytes per Sector
Recording Method
Track Density
512
48/52 CC2EPRML
33,000 TPI
364,119 BPI
7,200 rpm
Bit Density
491,112 BPI
491,112 BPI
Rotational Speed
Average Latency
Positioning time (Fast)
4.17 ms
•
•
•
Minimum
Average
Maximum
(Read) 0.8 ms typical, (Write) 1.0 ms typical
(Read) 8.5 ms typical, (Write) 9.5 ms typical
(Read) 16 ms typical, (Write) 17 ms typical
Positioning time (Slow)
•
•
•
Minimum
Average
Maximum
(Read) 0.8 ms typical, (Write) 1.0 ms typical
(Read) 11 ms typical, (Write) 12 ms typical
(Read) 20 ms typical, (Write) 21 ms typical
Start/Stop time
• Start (0 rpm to Drive Read)
Typical: 8 sec.,
Typical: 20 sec.,
Maximum: 15 sec.
Maximum: 30 sec.
•
Stop (at Power Down)
Interface
ATA–5
(Maximum Cable length: 0.46 m)
Data Transfer Rate
•
To/From Media
38.0 to 60.7 MB/s
27.9 to 49.7 MB/s
38.0 to 60.7 MB/s
16.7 MB/s Max. (burst PIO mode 4, burst DMA mode 2),
66.6 MB/s Max. (burst ultra DMA mode 4)
•
To/From Host
100.0 MB/s Max. (burst ultra DMA mode 5)
Data buffer
2 MB
Physical Dimensions
(Height × Width × Depth)
26.1 mm max. × 101.6 mm × 146.0 mm
(1.0” max. × 4.0” × 5.7”)
Weight
600 g or less
*1: Capacity under the LBA mode.
Under the CHS mode (normal BIOS specification), formatted capacity, number of cylinders, number of heads, and number of
sectors are as follows.
1 - 4
C141-E116-01EN
Model
Formatted Capacity
20,496 MB
No. of Cylinder
16,383
No. of Heads
No. of Sectors
MPG3204AH-E
MPG3307AH-E
MPG3409AH-E
16
16
16
63
63
63
30,743 MB
16,383
40,992 MB
16,383
1.2.2
Model and product number
Table 1.2 lists the model names and product numbers.
Table 1.2 Model names and product numbers
Capacity
(user area)
Mounting
Screw
Model Name
Order No.
Remarks
MPG3204AH-E
MPG3307AH-E
MPG3409AH-E
20.49 GB
30.74 GB
40.99 GB
No. 6-32UNC
No. 6-32UNC
No. 6-32UNC
CA05762-B521
CA05762-B544
CA05762-B542
—
—
—
1.3
Power Requirements
Input Voltage
(1)
•
•
+ 5 V ±5 %
+ 12 V ±8 %
(2)
Ripple
+12 V
+5 V
Maximum
Frequency
200 mV (peak to peak)
DC to 1 MHz
100 mV (peak to peak)
DC to 1 MHz
C141-E116-01EN
1 - 5
(3)
Current Requirements and Power Dissipation
Table 1.3 lists the current and power dissipation.
Table 1.3 Current and power dissipation
Typical RMS current (*1) [mA]
+12 V
Mode of Operation
Typical Power (*2) [watts]
MPG
+5 V
Model
MPG
MPG
MPG
All
MPG
MPG
3204AH-E
3307AH-E
3409AH-E
Models
3204AH-E
3307AH-E
3409AH-E
Spin up
1950 peak
350
1950 peak
400
1950 peak
400
800 peak
490
27.4
27.4
27.4
7.3
Idle (Ready) (*3)
R/W (On Track) (*4)
Seek (Random) (*5)
Standby
6.7
7.3
370
450
450
600
7.4
8.4
8.4
480
540
540
570
8.6
9.3
9.3
18
18
18
120
0.8
0.8
0.8
Sleep
18
18
18
120
0.8
0.8
0.8
Energy efficiency (rank) (*6) [watt / GB]
0.327 (A)
0.237 (B)
0.178 (B)
*1 Current is typical rms except for spin up.
*2 Power requirements reflect nominal values for +12V and +5V power.
*3 Idle mode is in effect when the drive is not reading, writing, seeking, or executing any commands. A portion of the R/W circuitry is powered down,
the spindle motor is up to speed and the Drive ready condition exists.
*4 R/W mode is defined as 50% read operations and 50% write operations on a single physical track.
*5 Seek/W/R mode is defined as 33% seek operations, 33% write operations, and 33% read operations.
*6 Energy efficiency based on the Law concerning the Rational Use of Energy indicates the value obtained by dividing power consumption by the storage
capacity. (Japan only)
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(4)
Current fluctuation (Typ.) when power is turned on
Note:
Maximum current is 1.95A.
Figure 1.1 Current fluctuation (Typ.) when power is turned on
(5)
Power on/off sequence
The voltage detector circuit monitors +5 V and +12 V. The circuit does not allow a write signal if
either voltage is abnormal. This prevents data from being destroyed and eliminates the need to be
concerned with the power on/off sequence.
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1.4
Environmental Specifications
Table 1.4 lists the environmental specifications.
Table 1.4 Environmental specifications
Temperature
• Operating
5°C to 55°C (ambient)
5°C to 60°C (disk enclosure surface)
• Non-operating
–40°C to 60°C
• Thermal Gradient
20°C/hour or less
Humidity
• Operating
• Non-operating
• Maximum Wet Bulb
8% to 80%RH (Non-condensing)
5% to 85%RH (Non-condensing)
29°C
Altitude (relative to sea level)
• Operating
–60 to 3,000 m (–200 to 10,000 ft)
–60 to 12,000 m (–200 to 40,000 ft)
• Non-operating
1.5
Acoustic Noise
Table 1.5 lists the acoustic noise specification.
Table 1.5 Acoustic noise specification
MPG3307AH-E
MPG3409AH-E
MPG3204AH-E
Model
Sound Power
per ISO 7779 and ISO9296
(Typical at 1m)
Idle mode (DRIVE READY)
Seek mode (Random)
3.6 bels
4.0 bels
31 dBA
35 dBA
3.3 bels
3.8 bels
Sound Pressure
(Typical at 1m)
Idle mode (DRIVE READY)
Seek mode (Random)
28 dBA
33 dBA
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1.6
Shock and Vibration
Table 1.6 lists the shock and vibration specification.
Table 1.6 Shock and vibration specification
Vibration (swept sine, one octave per minute)
• Operating
4.9 m/s2 (0.5G0-P); 5 to 300 Hz
(without non-recovered errors)
• Non-operating
39.2 m/s2 (4.0G0-P); 5 to 400 Hz (no damage)
Shock (half-sine pulse, Operating)
• 2 ms duration
392 m/s2 (40G0-P) (without non-recovered error)
2940 m/s2 (300G0-P) (Typical, no damage)
Shock (half-sine pulse, Non-operating)
• 2 ms duration
1.7
Reliability
(1)
Mean time between failures (MTBF)
The mean time between failures (MTBF) is 500,000 POH (power on hours) or more (operation: 24
hours/day, 7 days/week).
This does not include failures occurring during the first three months after installation.
MTBF is defined as follows:
Total operation time in all fields
MTBF=
(H)
number of device failure in all fields
"Disk drive defects" refers to defects that involve repair, readjustment, or replacement. Disk drive
defects do not include failures caused by external factors, such as damage caused by handling,
inappropriate operating environments, defects in the power supply host system, or interface cable.
(2)
(3)
Mean time to repair (MTTR)
The mean time to repair (MTTR) is 30 minutes or less, if repaired by a specialist maintenance staff
member.
CSS cycle
The number of CSS must be less than 50,000.
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(4)
Service life
In situations where management and handling are correct, the disk drive requires no overhaul for
five years when the DE surface temperature is less than 48°C. When the DE surface temperature
exceeds 48°C, the disk drives requires no overhaul for five years or 20,000 hours of operation,
whichever occurs first. Refer to item (3) in Subsection 3.3 for the measurement point of the DE
surface temperature.
(5)
1.8
(1)
Data assurance in the event of power failure
Except for the data block being written to, the data on the disk media is assured in the event of any
power supply abnormalities. This does not include power supply abnormalities during disk media
initialization (formatting) or processing of defects (alternative block assignment).
Error Rate
Known defects, for which alternative blocks can be assigned, are not included in the error rate
count below. It is assumed that the data blocks to be accessed are evenly distributed on the disk
media.
Unrecoverable read error
Read errors that cannot be recovered by read retries without user's retry and ECC corrections shall
occur no more than 10 times when reading data of 1015 bits. Read retries are executed according to
the disk drive's error recovery procedure, and include read retries accompanying head offset
operations.
(2)
Positioning error
Positioning (seek) errors that can be recovered by one retry shall occur no more than 10 times in
107 seek operations.
1.9
Media Defects
Defective sectors are replaced with alternates when the disk is formatted prior to shipment from the
factory (low level format). Thus, the host sees a defect-free device.
Alternate sectors are automatically accessed by the disk drive. The user need not be concerned
with access to alternate sectors.
Chapter 6 describes the low level format at shipping.
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CHAPTER 2
DEVICE CONFIGURATION
2.1
2.2
Device Configuration
System Configuration
2.1
Device Configuration
Figure 2.1 shows the disk drive. The disk drive consists of a disk enclosure (DE), read/write
preamplifier, and controller PCA. The disk enclosure contains the disk media, heads, spindle
motors actuators, and a circulating air filter.
Figure 2.1 Disk drive outerview
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2 - 1
(1)
Disk
The outer diameter of the disk is 95 mm. The inner diameter is 25 mm. The number of disks used
varies with the model, as described below. The disks are rated at over 50,000 start/stop
operations.
MPG3204AH-E: 1 disks
MPG3307AH-E: 2 disks
MPG3409AH-E: 2 disks
(2)
Head
The heads are of the contact start/stop (CSS) type. The head touches the disk surface while the
disk is not rotating and automatically lifts when the disk starts.
(3)
(4)
Spindle motor
The disks are rotated by a direct drive Hall-less DC motor.
Actuator
The actuator uses a revolving voice coil motor (VCM) structure which consumes low power and
generates very little heat. The head assembly at the tip of the actuator arm is controlled and
positioned by feedback of the servo information read by the read/write head. If the power is not on
or if the spindle motor is stopped, the head assembly stays in the specific CSS zone on the disk and
is fixed by a mechanical lock.
(5)
Air circulation system
The disk enclosure (DE) is sealed to prevent dust and dirt from entering. The disk enclosure
features a closed loop air circulation system that relies on the blower effect of the rotating disk.
This system continuously circulates the air through the recirculation filter to maintain the
cleanliness of the air in the disk enclosure.
(6)
(7)
Read/write circuit
The read/write circuit uses a LSI chip for the read/write preamplifier. It improves data reliability
by preventing errors caused by external noise.
Controller circuit
The controller circuit consists of a LSI chip to improve reliability. The high-speed microprocessor
unit (MPU) achieves a high-performance AT controller.
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C141-E116-01EN
2.2
System Configuration
ATA interface
2.2.1
Figures 2.2 and 2.3 show the ATA interface system configuration. The drive has a 40-pin PC AT
interface connector and supports the PIO transfer till 16.7 MB/s (PIO mode 4), the DMA transfer
till 16.7 MB/s (Multiword DMA mode 2), the ultra DMA transfer till 66.6 MB/s (Ultra DMA
mode 4), and the ultra DMA transfer till 100 MB/s (Ultra mode 5).
2.2.2
1 drive connection
HA
Host
Disk drive
(Host adaptor)
ATA interface
AT bus
(Host interface)
Figure 2.2 1 drive system configuration
2.2.3
2 drives connection
HA
Host
Disk drive #0
(Host adaptor)
AT bus
(Host interface)
Disk drive #1
ATA interface
Note:
When the drive that is not conformed to ATA is connected to the disk drive is above
configuration, the operation is not guaranteed.
Figure 2.3 2 drives configuration
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IMPORTANT
HA (host adapter) consists of address decoder, driver, and receiver.
ATA is an abbreviation of "AT attachment". The disk drive is
conformed to the ATA-5 interface.
At high speed data transfer (PIO mode 3, mode 4, DMA mode 2, ultra
DMA mode 4 or ultra DMA mode 5), occurrence of ringing or
crosstalk of the signal lines (AT bus) between the HA and the disk drive
may be a great cause of the obstruction of system reliability. Thus, it is
necessary that the capacitance of the signal lines including the HA and
cable does not exceed the ATA-3, ATA-4 and ATA-5 standard, and the
cable length between the HA and the disk drive should be as short as
possible.
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C141-E116-01EN
CHAPTER 3
INSTALLATION CONDITIONS
3.1
3.2
3.3
3.4
3.5
Dimensions
Handling Cautions
Mounting
Cable Connections
Jumper Settings
3.1
Dimensions
Figure 3.1 illustrates the dimensions of the disk drive and positions of the mounting screw holes.
All dimensions are in mm.
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3 - 1
Figure 3.1 Dimensions
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C141-E116-01EN
3.2
Handling Cautions
Please keep the following cautions, and handle the HDD under the safety environment.
3.2.1
General notes
ESD mat
Shock absorbing mat
Wrist strap
Place the shock absorbing mat on the
operation table, and place ESD mat on it.
Use the Wrist strap.
Do not hit HDD each other.
Do not stack when carrying.
Do not place HDD vertically
to avoid falling down.
Do not drop.
Figure 3.2 Handling cautions
3.2.2
Installation
(1)
Please use the driver of a low impact when you use an electric driver.
HDD is occasionally damaged by the impact of the driver.
(2)
Please observe the tightening torque of the screw strictly.
6-32UNC ······· Max. 0.59 N·m (6 Kg·cm)
3.2.3
Recommended equipments
Contents
Model
JX-1200-3056-8
76000DES (ASK7876)
SS-3000
Maker
SUMITOMO 3M
COMKYLE
HIOS
ESD
Wrist strap
ESD mat
Shock
Low shock driver
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3 - 3
3.3
Mounting
(1)
Direction
Figure 3.3 illustrates normal direction for the disk drive. The disk drives can be mounted in any
direction.
Horizontal mounting with the PCB facing down
Figure 3.3 Direction
(2)
Frame
The disk enclosure (DE) body is connected to signal ground (SG) and the mounting frame is also
connected to signal ground. These are electrically shorted.
Note:
Use No.6-32UNC screw for the mounting screw and the screw length should satisfy the
specification in Figure 3.5.
(3)
Limitation of side-mounting
When the disk drive is mounted using the screw holes on both side of the disk drive, use two screw
holes shown in Figure 3.4.
Do not use the center hole. For screw length, see Figure 3.5.
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C141-E116-01EN
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